Wireless apparatus

ABSTRACT

According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2016-160709, filed on Aug. 18, 2016; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a wireless apparatus.

BACKGROUND

A method has been known in the past in which a surface of sealing resinchat seals a semiconductor chip is covered with a conductive layer inorder to give a shielding function to a semiconductor package of thesemiconductor chip mounted on an interposer. Meanwhile, a technique forimplementing an internal antenna module has been proposed in which anaperture extending to a conductive portion of an interposer from aprincipal surface portion of a conductive layer for shielding (a surfacefacing a component mounting surface of the interposer) via a sidesurface portion thereof (a surface facing a side surface of theinterposer) is provided to cause this aperture to function as a slotantenna.

However, according to the conventional technique, approximately a halfof the slot antenna is constituted by the aperture provided at theconductive portion of the interposer and thus, the interposer has alarge antenna-occupied area by the aperture portion. As a result, anarea of an antenna section where a wiring pattern for a signal linecannot be provided increases at the conductive portion of theinterposer, thereby having caused a problem in which reduction in sizeof the interposer is difficult to achieve.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a wireless apparatus according to a firstembodiment;

FIG. 2 is a lateral view of the wireless apparatus according to thefirst embodiment;

FIG. 3 is a cross-sectional view of the wireless apparatus according tothe first embodiment;

FIG. 4 is a view for explaining a third slot aperture;

FIG. 5 is a view for explaining another example of a first slotaperture;

FIG. 6 is a top view of a wireless apparatus according to a secondembodiment;

FIG. 7 is a lateral view of the wireless apparatus according to thesecond embodiment;

FIG. 8 is a view for explaining a third slot aperture;

FIG. 9 is a conceptual view for explaining matching adjustment of a slotantenna; and

FIG. 10 is a view for explaining another example of the slot antenna.

DETAILED DESCRIPTION

According to an embodiment, a wireless apparatus includes an interposer,a semiconductor chip, a sealing resin, a conductive layer, at least onefirst slot aperture, at least one second slot aperture, and at least onethird slot aperture. The interposer includes a conductive portion. Thesemiconductor chip is mounted on a component mounting surface of theinterposer. The sealing resin is provided on the component mountingsurface of the interposer and seals the semiconductor chip. Theconductive layer covers a surface of the sealing resin and a sidesurface of the interposer and is electrically connected to theconductive portion of the interposer. The first slot aperture isprovided on a principal surface portion of the conductive layer facingthe component mounting surface of the interposer. The second slotaperture is provided on a side surface portion of the conductive layerfacing the side surface of the interposer and continues to the firstslot aperture. The third slot aperture is provided at the conductiveportion of the interposer and continues to the second slot aperture. Thefirst slot aperture, the second slot aperture, and the third slotaperture function as a slot antenna. A total length of the first slotaperture is longer than a total length of the third slot aperture.

Embodiments will be described in detail below with reference to theaccompanying drawings. Note that, in the following description,constituent members having similar functions will be denoted by the samereference numeral and the duplicated description will be omitted asappropriate.

First Embodiment

First, a wireless apparatus 100A according to a first embodiment will bedescribed with reference to FIG. 1 to FIG. 4, FIG. 1 is a top view ofthe wireless apparatus 100A according to the first embodiment whenviewed from a z-axis direction in FIG. 1; FIG. 2 is a lateral view ofthe wireless apparatus 100A according to the first embodiment whenviewed from a y-axis direction in FIG. 2; FIG. 3 is a cross-sectionalview when a cross-section taken along a line segment A-A′ in FIG. 1 isviewed from the y-axis direction in FIG. 3; and FIG. 4 is a view forexplaining a third slot aperture provided at a conductive portion of aninterposer.

The wireless apparatus 100A according to the embodiment is configuredsuch that a semiconductor chip 102 mounted on an interposer 101 issealed with sealing resin 103 and surfaces of the sealing resin 103 andside surfaces of the interposer 101 are covered with a conductive layer104. The wireless apparatus 100A having such a configuration is called asemiconductor package or a module with a shielding function.

The interposer 101 is a substrate obtained by forming a conductiveportion made of a metal material such as copper on an insulating layerinsulating layer and has a function as a relay member for connecting acomponent such as the semiconductor chip 102 mounted on this interposer101 to a larger circuit substrate than a circuit substrate in which thewireless apparatus 100A is to be mounted. Such conductors of theinterposer 101 are provided at least on a side of a component mountingsurface 101 a on which a component such as the semiconductor chip 102 ismounted and on a side of a back surface on an opposite side of thiscomponent mounting surface 101 a (a surface to be located on a side ofthe aforementioned circuit substrate). Some interposers 101 have amultilayer structure provided with one or more layers of the conductiveportions between these surfaces as well. A wiring pattern, a ground, andso on of the interposer 101 are provided at these conductors. FIG. 4exemplifies, as a conductive portion 120, a part of the ground providedadjacent to the side surface of the interposer 101.

The semiconductor chip 102 is configured by forming metal patterns madeof, for example, copper, aluminum, or gold in or on an outermost layerof a semiconductor substrate made of a material such as silicon, silicongermanium, or gallium, arsenide and has therein a transmission/receptioncircuit for transmitting and receiving a signal. The semiconductor chip102 is mounted on the component mounting surface 101 a of the interposer101 to be electrically connected thereto via the wiring pattern, theground, a bonding wire, a bump, and so on of the interposer 101.

Note that the semiconductor chip 102 may be composed of a dielectricsubstrate, a magnetic material substrate, a metal, or a combinationthereof. Meanwhile, the semiconductor chip 102 may be configured as achip size package (CSP). Although FIG. 3 and FIG. 4 show an examplewhere the single semiconductor chip 102 is mounted on the interposer101, a configuration with the plurality of semiconductor chips 102mounted on the interposer 101 may be employed. In this case, theplurality of semiconductor chips 102 may be mounted in a stacked state,or alternatively, may be mounted by being placed side by side.Furthermore, although FIG. 3 and FIG. 4 show an example where the singlesemiconductor chip 102 is mounted on the interposer 101, othercomponents such as capacitors, resistances, inductors, crystaloscillators and an IC may be mounted on the interposer 101 in additionto the semiconductor chip 102.

The sealing resin 103 is made of a thermosetting formation materialobtained by, for example, adding a silica filler or the like to epoxyresin serving as a main component and, for the purpose of the protectionof the semiconductor chip 102, arranged on the component mountingsurface 101 a of the interposer 101 to seal the semiconductor chip 102.The sealing resin 103 is an example of a sealing resin to seal thesemiconductor chip 102. The sealing resin is not limited to resin andmay be configured by using another non-conductive material or aninsulating material.

The conductive layer 104 is made of a metal material with highconductivity such as copper and silver or a conductive pasts that is amixture of a metal material such as silver and an insulating materialsuch as the epoxy resin, and is formed as a film covering the surface ofthe sealing resin 103 (a surface on an outer side) and the side surfaceof the interposer 101. That is, the wireless apparatus 100A according tothe embodiment has a configuration in which an entire surface of theinterposer 101 except the back surface thereof is covered with theconductive layer 104. In the present specification, a surface of theconductive layer 104 facing the component mounting surface 101 a of theinterposer 101 is called a principal surface portion 104 a of theconductive layer 104 (refer to FIG. 1). Additionally, surfaces of theconductive layer 104 facing the side surfaces of the interposer 101 arecalled side surface portions 104 b of the conductive layer 104 (refer toFIG. 2).

Although the illustration is omitted, a base film made of stainlesssteel, titanium, or the like is formed between the sealing resin 103 andthe conductive layer 104 in order to prevent the conductive layer 104from peeling off. In addition, for the purpose of preventing oxidationand corrosion, a cap layer made of stainless steel, titanium, or thelike is formed on a surface of the conductive layer 104.

The conductive layer 104 has a shielding function that suppresses aleakage of a high frequency electromagnetic wave (several tens ofmegahertz to several gigahertz)mainly generated, from the semiconductorchip 102 to the outside of the wireless apparatus 100A as radiationnoise. A shielding effectiveness by the conductive layer 104 depends ona sheet resistance value obtained by dividing the resistivity of theconductive layer 104 by the thickness of the conductive layer 104. Inorder to be able to suppress the leakage of the radiation noise, it isdesirable to configure the conductive layer 104 to have the sheetresistance value equal to or lower than 0.5Ω.

Meanwhile, the conductive layer 104 is electrically connected to theconductive portion 120 of the interposer 101. That is, because theconductive layer 104 does not cover the surface of the sealing resin 103but also the side surfaces of the interposer 101, the conductive layer104 is in contact with the conductive portion 120 serving as the groundon the side surface of the interposer 101 and thus, electricallyconnected to the conductor 120. The conductive layer 104 is connected tothe ground of the interposer 101 with a low resistance, therebyobtaining high shielding effectiveness.

In the wireless apparatus 100A according to the embodiment, a slot,antenna is constituted by a slot aperture (a slit) provided from theconductive layer 104 up to the conductive portion 120 of the interposer101. Specifically, as shown in FIG. 1, a first slot aperture 111 isprovided on the principal surface portion 104 a of the conductive layer104. In addition, as shown in FIG. 2, a second slot aperture 112continuing to the first slot aperture 111 is provided on the sidesurface portion 104 b of the conductive layer 104. Besides, as shown inFIG. 4, a third slot aperture 113 continuing to the second slot aperture112 is provided at the conductive portion 120 of the interposer 101.

The second slot aperture 112 is provided on the side surface portion 104b of the conductive layer 104 in such a manner that an end portion on anupper side in FIG. 2 is joined to one end portion e1 of the first slotaperture 111 shown in FIG. 1 and an end portion on a lower side in FIG.2 is joined to one end portion e1 of the third slot aperture 113 shownin FIG. 4. Accordingly, the first slot aperture 111, the second slotaperture 112, and the third slot aperture 113 constitute a slotaperture. Additionally, a length (a slot length) from another endportion e2 of the first slot aperture 111 shown in FIG. 1 to another endportion e4 of the third slot aperture 113 shown in FIG. 4 is set tocorrespond to approximately a half wavelength of a desired frequencyused in the communication by the wireless apparatus 100A.

Meanwhile, as shown in FIG. 4, the third slot aperture 113 is providedat the conductive portion 120 of the interposer 101 in such a manner asto intersect an antenna feeder 121 joined to the semiconductor chip 102mounted on the interposer 101. Thus, the integrated slot apertureconstituted by the first slot aperture 111, the second slot aperture112, and the third slot aperture 113 functions as the slot antenna whenelectricity is supplied by the antenna feeder 121 throughelectromagnetic coupling feeding (or coplanar feeding), thereby beingable to efficiently radiate or receive the electromagnetic wave at thedesired frequency.

The first slot aperture 111 and the second slot aperture 112 are formedby forming the conductive layer 104 so as to cover the surface of thesealing resin 103 and the side surfaces of the interposer 101 andthereafter, carrying out cutting processing on the principal surfaceportion 104 a and the side surface portion 104 b of the conductive layer104 by using, for example, a laser machine or an end milling machine.The third slot aperture 113 is formed simultaneously with forming thewiring pattern and the like on the conductive portion 120 of theinterposer 101.

Here, in the wireless apparatus 100A according to the embodiment, amongthe slot apertures constituting the slot antenna, the total length ofthe first slot aperture 111 provided on the principal surface portion104 a of the conductive layer 104 is made longer than the total lengthof the third slot aperture 113 provided at the conductive portion 120 ofthe interposer 101. In other words, a length from the one end portion e1to the another end portion e2 of the first slot aperture 111 shown inFIG. 1 is longer than a length from the one end portion e3 to theanother end portion e4 of the third slot aperture 113 shown in FIG. 4.

Because the third slot aperture 113 is provided at the conductiveportion 120 of the interposer 101, a section of the conductive portion120 of the interposer 101 where the third slot aperture 113 is providedis deemed as an antenna section where the wiring pattern cannot beprovided. As described above, the length of the slot aperturesconstituting the slot antenna (slot length) is determined on the basisof the frequency used in the communication by the wireless apparatus100A. Accordingly, in the case of employing a configuration where thethird slot aperture 113 contributes to a large part of this length, anarea of the antenna section increases with respect to the conductiveportion 120 of the interposer 101 and acts as a primary factor hinderingreduction in size of the interposer 101 and in turn, reduction in sizeof the wireless apparatus 100A.

In contrast to this, in the wireless apparatus 100A according to theembodiment, the total length of the first slot aperture 111 is madelonger than the total length of the third slot aperture 113 such thatthe first slot aperture 111 contributes to a large part of the slotlength of the slot antenna. Therefore, an area of the antenna section ismade smaller with respect to the conductive portion 120 of theinterposer 101, whereby reduction in size of the interposer 101 can beachieved.

In addition, in the wireless apparatus 100A according to the embodiment,the first slot aperture 111 is provided on the principal surface portion104 a of the conductive layer 104 at a position not overlapping thesemiconductor chip 102. In other words, the first slot aperture 111 isnot provided at a section of the principal surface portion 104 a of theconductive layer 104 located just above the semiconductor chip 102mounted on the interposer 101 but an entire surface of the section justabove the semiconductor chip 102 is covered with the conductive layer104.

As described above, when the first slot aperture 111 is configured tocontribute to a large part of the slot length of the slot antenna, anaperture area relative to the conductive layer 104 increases and thus,concerns about a decrease in the shielding effectiveness by theconductive layer 104 occur. However, by providing the first slotaperture 111 on the principal surface portion 104 a of the conductivelayer 104 at a position not overlapping the semiconductor chip 102, adecrease in the shielding effectiveness by the conductive layer 104 canbe effectively suppressed. That is, the electromagnetic wave to beshielded by the conductive layer 104 is predominantly generated from thesemiconductor chip 102 and accordingly, when the first slot aperture illis provided by avoiding the section located just above the semiconductorchip 102 to obtain a configuration, where the section just above thesemiconductor chip 102 is covered with the conductive layer 104, adecrease in the shielding effectiveness can be reduced. In particular,as shown in FIG. 1, when the first slot aperture 111 is provided so asto extend along an end edge of the principal surface portion 104 a ofthe conductive layer 104 at a position close to the end edge (a boundarywith the side surface portion 104 b) such that the position of the firstslot aperture 111 is set to a position as far away from the sectionlocated just above the semiconductor chip 102 as possible, a highshielding effectiveness can be obtained even with the first slotaperture 111 having a longer total length.

In addition, in the case of employing a configuration where the firstslot aperture 111 is provided on the principal surface portion 104 a ofthe conductive layer 104 at a position not overlapping the semiconductorchip 102, an effect is also obtained in which the first slot aperture111 can be formed without damaging the semiconductor chip 102.Specifically, in a case where the first slot aperture 111 is formed bycarrying out the cutting processing on the principal surface portion 104a of the conductive layer 104 by using the laser machine, there areconcerns about damage to the semiconductor chip 102 due to laser lightwhen the semiconductor chip 102 is located just under a position to beirradiated with the laser light. In contrast to this, with aconfiguration where the first slot aperture 111 is provided on theprincipal surface portion 104 a of the conductive layer 104 at aposition not overlapping the semiconductor chip 102, the section justabove the semiconductor chip 102 is not irradiated with the laser lightduring the cutting processing using the laser machine and consequently,damage to the semiconductor chip 102 is not caused by the laser light.

The shape of the first slot aperture 111 shown in FIG. 1 serves as anexample and is not limited thereto. The first slot aperture 111 is onlyrequired to be provided on the principal surface portion 104 a of theconductive layer 104 such that the total length thereof, namely, alength from the one end portion e1 to the another end portion e2 islonger that the total length of the third slot aperture 113 and thesection just above the semiconductor chip 102 is avoided (so as not tooverlap the semiconductor chip 102). In a case where the semiconductorchip 102 is configured to be arranged at the center of the interposer101, as shown in FIG. 5 as an example, the first slot aperture 111 canbe provided on the principal surface portion 104 a of the conductivelayer 104 by avoiding the section just above the semiconductor chip 102located at the center.

The wireless apparatus 100A according to the embodiment described aboveis configured as a package or a module provided with, for example, aball grid array (BGA) structure where a terminal formed by a solder ballis provided on a back surface side of the interposer 101. Alternatively,the wireless apparatus 100A may be configured as a package or a modulehaving a land grid array (LGA) structure where a land on the backsurface side of the interposer 101 is used as a terminal while theterminal by the solder ball is not provided. Note that, although theplanar shape of the wireless apparatus 100A exemplified in FIG. 1 toFIG. 4 has a quadrangular shape, an outer shape of the wirelessapparatus 100A is not limited to this example and can be set to variousshapes.

As described above, the wireless apparatus 100A according to theembodiment is configured in such a manner that the first slot aperture111 provided on the principal surface portion 104 a of the conductivelayer 104, the second slot aperture 112 provided on the side surfaceportion 104 b of the conductive layer 104, and the third slot aperture113 provided at the conductive portion 120 of the interposer 101 arejoined to one another so as to function as an integrated slot antenna.Additionally, the total length of the first slot aperture 111 providedon the principal surface portion 104 a of the conductive layer 104 ismade longer than the total length of the third slot aperture 113provided at the conductive portion 120 of the interposer 101. Therefore,according to the embodiment, an area of the antenna section is madesmaller with respect to the conductive portion 120 of the interposer101, whereby reduction in size of the interposer 101 can be achieved andalso reduction in size of the wireless apparatus 100A itself can beachieved.

Furthermore, according to the embodiment, the first slot aperture 111 isconfigured to be provided on the principal surface portion 104 a of theconductive layer 104 at a position not overlapping the semiconductorchip 102 and thus, a decrease in the shielding effectiveness by theconductive layer 104 can be effectively suppressed, while damage to thesemiconductor chip 102 caused during the processing on the first slotaperture 111 can be effectively prevented.

Second Embodiment

Next, a wireless apparatus 100B according to a second embodiment will bedescribed with reference to FIG. 6 to FIG. 8. FIG. 6 is a top view ofthe wireless apparatus 100B according to the second embodiment whenviewed from a z-axis direction in FIG. 6; FIG. 7 is a lateral view ofthe wireless apparatus 100B according to the second embodiment whenviewed from a y-axis direction in FIG. 7; and FIG. 8 is a view forexplaining a third slot aperture provided at a conductive portion of aninterposer. Note that a cross-sectional view of the wireless apparatus100B according to the second embodiment is omitted since it is similarto the cross-sectional view shown in FIG. 3.

The wireless apparatus 100B according to the second embodiment has abasic structure configured similarly to the wireless apparatus 100Aaccording to the first embodiment but has a configuration of the slotantenna different from that of the wireless apparatus 100A according tothe first embodiment. Specifically, in the wireless apparatus 100Baccording to the second embodiment, two first slot apertures 111 a and111 b are provided on a principal surface portion 104 a of a conductivelayer 104 as shown in FIG. 6. In addition, as shown in FIG. 7, twosecond slot apertures, namely, a second slot aperture 112 a continuingto the first slot aperture 111 a and a second slot aperture 112 bcontinuing to the first slot aperture 111 b are provided on a sidesurface portion 104 b of the conductive layer 104. Besides, as shown inFIG. 8, a third slot aperture 113 continuing to the two second slotapertures 112 a and 112 b is provided at a conductive portion 120 of aninterposer 101 in a shape to join these two second slot apertures 112 aand 112 b to each other.

One of the two second slot apertures 112 a and 112 b, specifically, thesecond slot aperture 112 a is provided on the side surface portion 104 bof the conductive layer 104 in such a manner that an end portion on anupper side in FIG. 7 is joined to one end portion e5 of the first slotaperture 111 a shown in FIG. 6 and an end portion on a lower side inFIG. 7 is joined to one end portion e9 of the third slot aperture 113shown in FIG. 8. The other of the two second slot apertures 112 a and112 b, specifically, the second slot aperture 112 b is provided on theside surface portion 104 b of the conductive layer 104 in such a mannerthat an end portion on the upper side in FIG. 7 is joined to one endportion e7 of the first slot aperture 111 b shown in FIG. 6 and an endportion on the lower side in FIG. 7 is joined to another end portion e10of the third slot aperture 113 shown in FIG. 8. Accordingly, the twofirst slot apertures 111 a and 111 b, the two second slot apertures 112a and 112 b, and the third slot aperture 113 constitute an integratedcontinuous slot aperture. Additionally, a length from another endportion e6 of the first slot aperture 111 a shown in FIG. 6 to anotherend portion e8 of the first slot aperture 111 b (slot length) is set tocorrespond to substantially a half wavelength of a desired frequencyused in the communication by the wireless apparatus 100B.

Furthermore, as shown in FIG. 8, the third slot aperture 113 is providedat the conductive portion 120 of the interposer 101 in such a manner asto intersect an antenna feeder 121 joined to a semiconductor chip 102mounted on the interposer 101. Thus, the integrated slot apertureconstituted by the two first slot apertures 111 a and 111 b, the twosecond slot apertures 112 a and 112 b, and the third slot aperture 113functions as the slot antenna when electricity is supplied by theantenna feeder 121 through electromagnetic coupling feeding, therebybeing able to efficiently radiate or receive the electromagnetic wave atthe desired frequency.

Alternatively, one of the two second slot apertures 112 a and 112 b canbe provided on one of the plurality of side surface portions 104 b ofthe conductive layer 104, while providing the other thereof on anotherside surface portion 104 b. However, as shown in FIG. 7, when the twosecond slot apertures 112 a and 112 b are configured to be provided onone and the same side surface portion 104 b of the conductive layer 104,the second slot apertures 112 a and 112 b can be processed in a simpleand easy manner. Specifically, in a case where the second slot apertures112 a and 112 b are formed by carrying out the cutting processing on theside surface portion 104 b of the conductive layer 104 by using the endmilling machine, when a configuration where the two second slotapertures 112 a and 112 b are provided on one and the same side surfaceportion 104 b of the conductive layer 104 is employed, the two secondslot apertures 112 a arid 112 b can be formed through one processwithout rotating the wireless apparatus 100B.

Also in the wireless apparatus 100B according to the second embodiment,among the slot apertures constituting the slot antenna, the total lengthof the first slot apertures 111 a and 111 b provided on the principalsurface portion 104 a of the conductive layer 104 is made longer thanthe total length of the third slot aperture 113 provided at theconductive portion 120 of the interposer 101. In other words, a sum of alength from the one end portion e5 to the another end portion e6 of thefirst slot aperture 111 a and a length from the one end portion e7 tothe another end portion e8 of the first slot aperture 111 b shown inFIG. 6 is longer than a length from the one end portion e9 to theanother end portion e10 of the third slot aperture 113 shown in FIG. 8.Therefore, also in the second embodiment, an area of the antenna sectionis made smaller with respect to the conductive portion 120 of theinterposer 101, whereby an effect that achieves reduction in size of theinterposer 101 can be obtained as in the first embodiment.

In addition, also in the wireless apparatus 100B according to the secondembodiment, the first slot apertures 111 a and 111 b are provided on theprincipal surface portion 104 a of the conductive layer 104 at positionsnot overlapping the semiconductor chip 102. Consequently, also in thesecond embodiment, an effect is obtained as in the first embodiment inwhich a decrease in the shielding effectiveness by the conductive layer104 can be effectively suppressed, while damage to the semiconductorchip 102 caused during the processing on the first slot apertures 111 aand 111 b can be effectively prevented.

Additionally, in the configuration according to the second embodiment,the another end portion e6 of one of the two first slot apertures 111 aand 111 b shown in FIG. 6, specifically, the first slot aperture ilia(an end portion on an opposite side of the end portion e5 located on aside of the second slot aperture 112 a) serves as one end portion of theslot antenna, whereas the another end portion e8 of the other thereof,specifically the first slot aperture 111 b (an end portion on anopposite side of the end portion e7 located on a side of the second slotaperture 112 b) serves as another end portion of the slot antenna. Inshort, both of the end portions of the slot antenna are configured to bearranged on the principal surface portion 104 a of the conductive layer104. With such a configuration, by adjusting the position of the anotherend portion e6 of the one first slot aperture 111 a and the position ofthe another end portion e8 of the other first slot aperture 111 b whilethe two first slot apertures 111 a and 111 b are formed on the principalsurface portion 104 a of the conductive layer 104, both of theadjustment of a resonance frequency of the slot antenna and theadjustment of impedance matching of the slot antenna can be carried outin a simple and easy manner.

FIG. 9 is a conceptual view for explaining matching adjustment of theslot antenna. Typically, as shown in FIG. 9, impedance adjustment forthe slot antenna can be implemented by adjusting a relative position ofthe antenna feeder 121 in a slot length direction of the slot antenna(SA in FIG. 9. In the wireless apparatus 100B according to the secondembodiment, the position of the antenna feeder 121 and the position ofthe third slot aperture 113 provided at the conductive portion 120 arefixed on the interposer 101 and accordingly, in order to adjust therelative position of the antenna feeder 121 in the slot length directionof the slot antenna, positions of both of the end portions of the slotantenna needs to be adjusted. In addition, as described earlier, theslot length of the slot antenna is designed to correspond to a halfwavelength of a desired frequency. Actually, however, the dielectricconstant within the conductive layer 104 varies depending on, forexample, a state of the sealing resin 103 and the wavelength varies inturn. For this reason, the resonance frequency needs to be adjusted byadjusting the slot length of the slot antenna.

Here, in the second embodiment, both of the end portions of the slotantenna are arranged together on the principal surface portion 104 a ofthe conductive layer 104 as the end portion e6 of the first slotaperture 111 a and the end portion e8 of the first slot aperture 111 b.Accordingly, the adjustment of the relative position of the antennafeeder 121 in the slot length direction of the slot antenna and theadjustment of the slot length of the slot antenna can be simultaneouslycarried out through position adjustment of these end portions e6 and e8.That is, both of the adjustment of the resonance frequency of the slotantenna and the adjustment of the impedance matching of the slot antennacan be carried out in a simple and easy manner.

The configuration of the slot antenna according to the second embodimentdescribed above serves as an example and is not limited thereto. Theslot antenna according to the second embodiment is only required to havea configuration in which a plurality of first slot apertures 111provided on the principal surface portion 104 a of the conductive layer104, a plurality of second slot apertures 112 provided on the sidesurface portion 104 b of the conductive layer 104, and at least the onethird slot aperture 113 provided at the conductive portion 120 of theinterposer 101 are joined to one another as an integrated unit. Forexample, as shown in FIG. 10, the slot antenna may be configured byjoining three first slot apertures 111 a, 111 b, and 111 c, four secondslot apertures 112 a, 112 b, 112 c, and 112 d, and two third slotapertures 113 a and 113 b to one another as an integrated unit.

According to at least one of the embodiments described above, reductionin size of the interposer 101 can be achieved.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fail within the scope andspirit of the inventions.

What is claimed is:
 1. A wireless apparatus comprising: an interposerincluding a conductive portion; a semiconductor chip mounted on acomponent mounting surface of the interposer; a sealing resin providedon the component mounting surface of the interposer and sealing thesemiconductor chip; a conductive layer covering a surface of the sealingresin and a side surface of the interposer and electrically connected tothe conductive portion of the interposer; at least one first slotaperture provided on a principal surface portion of the conductive layerfacing the component mounting surface of the interposer; at least onesecond slot aperture provided on a side surface portion of theconductive layer facing the side surface of the interposer andcontinuing to the first slot aperture; and at least one third slotaperture provided at the conductive portion of the interposer andcontinuing to the second slot aperture; wherein the at least one firstslot aperture, the at least one second slot aperture, and the at leastone third slot aperture function as an integrated slot antenna, a totallength of the at least one first slot aperture is longer than a totallength of the at least one third slot aperture, and the at least onefirst slot aperture has a bent shape.
 2. The apparatus according toclaim 1, wherein the at least one first slot aperture is provided on theprincipal surface portion of the conductive layer at a position notoverlapping the semiconductor chip.
 3. The apparatus according to claim1, wherein the at least one first slot aperture includes a plurality offirst slot apertures, and the at least one second slot aperture includesa plurality of second slot apertures, each of the plurality of secondslot apertures continuing to one of the plurality of first slotapertures, respectively.
 4. The apparatus according to claim 3, whereinthe conductive layer includes a plurality of the side surface portions,and the plurality of second slot apertures are provided on one of theside surface portions of the conductive layer.
 5. The apparatusaccording to claim 3, wherein both ends of the integrated slot antennaare located on the principal surface portion of the conductive layer. 6.A wireless apparatus comprising: an interposer including a conductiveportion; a semiconductor chip mounted on a component mounting surface ofthe interposer; a sealing resin provided on the component mountingsurface of the interposer and sealing the semiconductor chip; aconductive layer covering a surface of the sealing resin and a sidesurface of the interposer and electrically connected to the conductiveportion of the interposer; at least one first slot aperture provided ona principal surface portion of the conductive layer facing the componentmounting surface of the interposer; at least one second slot apertureprovided on a side surface portion of the conductive layer facing theside surface of the interposer and continuing to the first slotaperture; and at least one third slot aperture provided at theconductive portion of the interposer and continuing to the second slotaperture; wherein the at least one first slot aperture, the at least onesecond slot aperture, and the at least one third slot aperture functionas an integrated slot antenna, a total length of the at least one firstslot aperture is longer than a total length of the at least one thirdslot aperture, and a total length of the integrated slot antenna islonger than a length of a long side of the interposer.
 7. The apparatusaccording to claim 6, wherein the at least one first slot aperture isprovided on the principal surface portion of the conductive layer at aposition not overlapping the semiconductor chip.
 8. The apparatusaccording to claim 6, wherein the at least one first slot apertureincludes a plurality of first slot apertures, and the at least onesecond slot aperture includes a plurality of second slot apertures, eachof the plurality of second slot apertures continuing to one of theplurality of first slot apertures, respectively.
 9. The apparatusaccording to claim 8, wherein the conductive layer includes a pluralityof the side surface portions, and the plurality of second slot aperturesare provided on one of the side surface portions of the conductivelayer.
 10. The apparatus according to claim 8, wherein both ends of theintegrated slot antenna are located on the principal surface portion ofthe conductive layer.
 11. A wireless apparatus comprising: an interposerincluding a conductive portion; a semiconductor chip mounted on acomponent mounting surface of the interposer; a sealing resin providedon the component mounting surface of the interposer and sealing thesemiconductor chip; a conductive layer covering a surface of the sealingresin and a side surface of the interposer and electrically connected tothe conductive portion of the interposer; at least one first slotaperture provided on a principal surface portion of the conductive layerfacing the component mounting surface of the interposer; at least onesecond slot aperture provided on a side surface portion of theconductive layer facing the side surface of the interposer andcontinuing to the first slot aperture; and at least one third slotaperture provided at the conductive portion of the interposer andcontinuing to the second slot aperture wherein the at least one firstslot aperture, the at least one second slot aperture, and the at leastone third slot aperture function as an integrated slot antenna, a totallength of the at least one first slot aperture is longer than a totallength of the at least one third slot aperture, the at least one firstslot aperture is provided on the principal surface portion of theconductive layer at a position not overlapping the semiconductor chip,and the at least one second slot aperture is provided on the sidesurface portion of the conductive layer at a position not overlappingthe semiconductor chip in a side view.
 12. The apparatus according toclaim 11, wherein the at least one first slot aperture includes aplurality of first slot apertures, and the at least one second slotaperture includes a plurality of second slot apertures, each of theplurality of second slot apertures continuing to one of the plurality offirst slot apertures, respectively.
 13. The apparatus according to claim12, wherein the conductive layer includes a plurality of the sidesurface portions, and the plurality of second slot apertures areprovided on one of the side surface portions of the conductive layer.14. The apparatus according to claim 12, wherein both ends of theintegrated slot antenna are located on the principal surface portion ofthe conductive layer.